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1 copyright ? 2010, everlight all rights reserved. re lease date : 10.06.2011. issue no: dhe-00000878 www.everlight.com ehp-c04/nt01a-p01/tr received mass production preliminary customer design device no. : dhe-0000878 page : 12 revised record rev. description release date 1 new spec 2010.08.25 2 1.change format 2.add vf v1 bin 2011.03.30 3 1.change format 2.change iv cct vf bin 3.change package dimension 2011.09.06 4. 1.new everlight logo 2. change format 2011.10.06
datasheet ehp-c04/nt01a-p01/tr 2 copyright ? 2010, everlight all rights reserved. re lease date : 10.06.2011. issue no: dhe-0000878 www.everlight.com ehp-c04/nt01a-p01/tr mass prodution features small & compact package and with high efficiency typical luminous flux: 160 lm @ 1000ma typical color temperature: 5700 k@1000ma optical efficiency@1a : 45 lm/w esd protection up to 8kv moisture sensitivity level (msl) class 1 grouping parameter: total luminous flux, color coor dinates. rohs compliant & pb free. applications mobile phone camera flash(camera flash light /strob e light for mobile devices ) torch light for dv(digital video) application indoor lighting applications signal and symbol luminaries for orientation maker lights (e.g. steps, exit ways, etc.) tft backlighting exterior and interior illumination applications decorative and entertainment lighting exterior and interior automotive illumination
datasheet ehp-c04/nt01a-p01/tr 3 copyright ? 2010, everlight all rights reserved. re lease date : 10.06.2011. issue no: dhe-0000878 www.everlight.com device selection guide chip materials emitted color ingan white absolute maximum ratings (t solder pad =25 ) parameter symbol rating unit dc forward current (ma) i f 350 ma peak pulse current (ma) (400ms : on 3600ms : off) i pulse 1500 ma esd resistance v b 8000 v reverse voltage v r [1] v junction temperature t j 125 thermal resistance(junction to lead) r s 10 /w operating temperature t opr -40 ~ +85 storage temperature t stg -40 ~ +110 power dissipation (pulse mode) p d 6.5 w soldering temperature t sol 260 allowable reflow cycles n/a 2 cycles viewing angle (2) 2 1/2 120 deg note: 1. the ehp-c04 series leds are not designed for rev erse bias used. 2. view angle tolerance is 5 . 3. avoid operating ehp-c04 series leds at maximum op erating temperature exceed 1 hour. 4. all specification is assured by reliability test for 1000hr, iv degradation less than 30%. 5. all reliability items are tested under good ther mal management with 1.0x 1.0 cm 2 mcpcb. 6. peak pulse current shall be applied under condit ions as max duration time 50ms and max duty cycle 1 0%. 7. operate led component at maximum rating conditio ns continuously will cause possible permanent damag e and de-rating parameters. exercise multiple maximum rating parameters simult aneously should not be allowed. when maximum rating parameters are applied over a long period will result potential reliability issue .
datasheet ehp-c04/nt01a-p01/tr 4 copyright ? 2010, everlight all rights reserved. re lease date : 10.06.2011. issue no: dhe-0000878 www.everlight.com jedec moisture sensitivity level floor life soak requirements standard time (hours) conditions time (hours) conditions 1 unlimited Q 30 / 85% rh 168(+5/-0) 85 / 85 rh electro -optical characteristics (t solder pad =25 ) parameter symbol min. typ. max. unit condition luminous flux (1) v 140 160 ---- lm i f =1000ma forward voltage (2) (3) v f 2.95 ---- 4.35 v correlated color temperature cct 4500 ---- 7000 k note: 1. luminous flux measurement tolerance: 10% 2. forward voltage measurement tolerance: 0.1v 3. electric and optical data is tested at 50 ms pul se condition bin range of forward voltage binning bin code min. typ. max. unit condition 2932 2.95 ---- 3.25 v i f =1000ma 3235 3.25 ---- 3.55 3538 3.55 ---- 3.85 3841 3.85 ---- 4.15 4143 4.15 ---- 4.35 bin range of luminous intensity bin code min. typ. max. unit condition j3 140 ----- 160 lm i f =1000ma j4 160 ---- 180 j5 180 ---- 200
datasheet ehp-c04/nt01a-p01/tr 5 copyright ? 2010, everlight all rights reserved. re lease date : 10.06.2011. issue no: dhe-0000878 www.everlight.com white bin structure 0.25 0.30 0.35 0.40 0.45 0.25 0.30 0.35 0.40 0.45 (3) (2) (1) 4500 5000 5700 7000 y x notes 1. color bin (1) : 4550k 2. color bin (2) : 5057k 3. color bin (3) : 4550k white bin coordinate bin cie-x cie-y cct reference range 4550 0.3738 0.4378 4500k ~ 5000k 0.3524 0.4061 0.3440 0.3420 0.3620 0.3720 5057 0.3300 0.3200 5000k ~ 5700k 0.3300 0.3730 0.3440 0.3420 0.3524 0.4061 5770 0.3030 0.3330 5700k ~ 7000k 0.3300 0.3730 0.3300 0.3200 0.3110 0.2920 note: 1. color coordinates measurement allowance: 0.01 2. color bins are defined at i f = 1000ma and 50ms pulse operation condition.
datasheet ehp-c04/nt01a-p01/tr 6 copyright ? 2010, everlight all rights reserved. re lease date : 10.06.2011. issue no: dhe-0000878 www.everlight.com typical electro -optical characteristics curves relative spectral distribution, i f =1000ma@50ms, t solder pad =25 4 0 0 5 0 0 6 0 0 7 0 0 8 0 0 0 . 0 0 . 2 0 . 4 0 . 6 0 . 8 1 . 0 w a v e l e n g t h ( n m ) relative intensity(a.u.) typical radiation patterns typical polar radiation pattern for lambertian relativety luminous intensity -90 -60 -30 0 30 60 90 0.0 0.2 0.4 0.6 0.8 1.0 relative intensity(a.u.) 2q (degree) x axis y axis 0.0 0.2 0.4 0.6 0.8 1.0 -90 -75 -60 -45 -30 -15 0 15 30 45 60 75 90 0.0 degree note: 1. 2 1/2 is the off axis angle from lamp centerline where th e luminous intensity is 1/2 of the peak value. 2. view angle tolerance is 5 . .
datasheet ehp-c04/nt01a-p01/tr 7 copyright ? 2010, everlight all rights reserved. re lease date : 10.06.2011. issue no: dhe-0000878 www.everlight.com forward voltage vs forward current, t solder pad =25 correlated color temperature(cct) vs. forward current 0 250 500 750 1000 1250 1500 2.1 2.4 2.7 3.0 3.3 3.6 3.9 4.2 forward voltage(v) forward current(ma@50ms) 0 250 500 750 1000 1250 1500 5400 5600 5800 6000 6200 correlated color temperatrue(k) forward current(ma@50ms) luminous flux vs forward current, t solder pad =25 forward current derating curve, derating based on t j max =125c at torch mode 0 250 500 750 1000 1250 1500 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 forward current(ma@50ms) relative luminous flux(lm) 0 25 50 75 100 0 100 200 300 400 500 forward current (ma) solder temperature ( o c ) note: 1. all correlation data is tested under superior th ermal management with 1.0x 1.0 cm 2 mcpcb
datasheet ehp-c04/nt01a-p01/tr 8 copyright ? 2010, everlight all rights reserved. re lease date : 10.06.2011. issue no: dhe-0000878 www.everlight.com package dimension chip position top view anode pad cathode pad 0,5 1,1 1,45 0,25 0,125 optical center 2,04 1,64 optical center 0.75 0 .3 -0. 05 /+0 0.3 1,64 note: 1. dimensions are in millimeters. 2. tolerances unless mentioned are 0.1mm.
datasheet ehp-c04/nt01a-p01/tr 9 copyright ? 2010, everlight all rights reserved. re lease date : 10.06.2011. issue no: dhe-0000878 www.everlight.com moisture resistant packing materials label explanation ? cpn: customer specification (when required) ? p/n: everlight production number ? qty: packing quantity ? cat: luminous flux (brightness) bin ? hue: color bin ? ref: forward voltage bin ? lot no: lot number carrier tape dimensions: loaded quantity 2000 pcs per reel polarity progress direction note: 1. dimensions are in millimeters. 2. tolerances unless mentioned are 0.1mm.
datasheet ehp-c04/nt01a-p01/tr 10 copyright ? 2010, everlight all rights reserved. re lease date : 10.06.2011. issue no: dhe-0000878 www.everlight.com reel dimensions note: 1. dimensions are in millimeters. moisture resistant packing process
datasheet ehp-c04/nt01a-p01/tr 11 copyright ? 2010, everlight all rights reserved. re lease date : 10.06.2011. issue no: dhe-0000878 www.everlight.com reflow soldering characteristics soldering and handling 1. over-current-proof though ehp-c04 series has conducted esd protection mechanism, customers must not use the device in rev erse and should apply resistors for extra protection. otherwise, slight voltage shi ft may cause enormous current shift and burn out fa ilure would happen. 2. storage i. do not open the moisture-proof bag before the produ cts are ready to use. ii. before opening the package, the leds should be store d at temperature less than 30 and less and relative humidity less than 90%. after opening the package, the leds should be store d at temperature less than 30 and relative humidity less than 85%. iii. if the moisture absorbent material (silicone gel) h as faded away or the leds have exceeded the storage time, baking treatment should be implemented based on the following conditions: p re-curing at 605 for 24 hours. 3. thermal management i. for maintaining the high flux output and achieving reliability, ehp-c04 series leds should be mounted on a metal core printed circuit board (mcpcb), with proper thermal connection to diss ipate approximately 1w to 5w of thermal energy unde r normal operation. ii. sufficient thermal management must be conducted, or the die junction temperature will be over the limi t under large electronic driving and leds lifetime will decrease critically iii. when operating , the solder pad temperature ( or th e board temperature nearby the led) must controlled under 70 . 4. soldering condition 4.1 soldering pad
datasheet ehp-c04/nt01a-p01/tr 12 copyright ? 2010, everlight all rights reserved. re lease date : 10.06.2011. issue no: dhe-0000878 www.everlight.com 4.2 for reflow process i. lead reflow soldering temperature profile i. reflow soldering should not be done more than two times. ii. while soldering, do not put stress on the leds dur ing heating. iii. after soldering, do not warp the circuit board.

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